International Printed Circuit & Electronics Assembly Fair is a leading trade fair for Circuit & Electronics industry. The event will provides a opportunity to meet all the Electronics suppliers, product vendors and downstream customers, manufacturers under one roof. The exhibition will showcase latest innovations for Circuit and Electronics Industry. Profile for exhibit includes Single Sided Boards, Flexible Boards, Double Sided Boards, Multilayer Boards, Panel Plating Process, Solder Mask Equipment, DES Line, Component Mark Printing, Testing Equipment Resin, Lamination Process, Electroplating Chemical, AOI Equipment, Component Insertion, Feeding Systems, Fine Pitch Placement, Flip Chip Technology, Multifunctional Placement, Ball Placement, Systems & Equipment.